EP4CGX50DF23C6N vs EP4CGX110DF23I7N Perbandingan
Perbandingan bersamaan detil EP4CGX50DF23C6N dari Intel dan EP4CGX110DF23I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX50DF23C6N | EP4CGX110DF23I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 109,424 |
| Configurable Logic Blocks (CLBs) | 3,118 | — |
| Embedded Memory | 2,340 Kbits | 4.4 Mbits (approximate) |
| Process Technology | 60 nm | 60 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Number of Pins / Balls | 484 | — |
| Package Type | 484-ball FBGA (PBGA) | — |
| JEDEC Package Code | S-PBGA-B484 | — |
| User I/O | 218 | — |
| Transceiver Channels | Up to 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Operating Temperature Grade | Commercial | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Logic Array Blocks (LABs) | — | 6,839 |
| User I/O Pins | — | 270 |
| Embedded 18x18 Multipliers | — | 56 |
| Transceivers | — | Up to 3.125 Gbps embedded transceivers |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Suhu Kerja | — | -40C to +100C (industrial) |
| Speed Grade | — | 7 |
| Paket | — | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch |
| Package Code | — | BGA (FBGA) |
| Status RoHS | — | Compliant |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |