EP4CGX50DF23C6N vs EP4CGX110DF23I7N 比較
詳細並排比較 EP4CGX50DF23C6N 由 Intel 與 EP4CGX110DF23I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4CGX50DF23C6N | EP4CGX110DF23I7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 109,424 |
| Configurable Logic Blocks (CLBs) | 3,118 | — |
| Embedded Memory | 2,340 Kbits | 4.4 Mbits (approximate) |
| Process Technology | 60 nm | 60 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Number of Pins / Balls | 484 | — |
| Package Type | 484-ball FBGA (PBGA) | — |
| JEDEC Package Code | S-PBGA-B484 | — |
| User I/O | 218 | — |
| Transceiver Channels | Up to 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Operating Temperature Grade | Commercial | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Logic Array Blocks (LABs) | — | 6,839 |
| User I/O Pins | — | 270 |
| Embedded 18x18 Multipliers | — | 56 |
| Transceivers | — | Up to 3.125 Gbps embedded transceivers |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| 工作溫度 | — | -40C to +100C (industrial) |
| Speed Grade | — | 7 |
| 封裝 | — | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch |
| Package Code | — | BGA (FBGA) |
| RoHS 狀態 | — | Compliant |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |