EP4SGX360FF35C2XN vs EP4SGX360FH29C2XN Perbandingan
Perbandingan bersamaan detil EP4SGX360FF35C2XN dari Intel dan EP4SGX360FH29C2XN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360FF35C2XN | EP4SGX360FH29C2XN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | C2 |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Paket | 1152-BBGA, FCBGA (Flip-Chip BGA) | — |
| Tipe Mounting | Surface Mount | — |
| Suhu Kerja | 0C to +85C (Commercial) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | EP4SGX |
| Logic Array Blocks (LABs) | — | 14,144 |
| Maximum User I/Os | — | 289 |
| Number of Terminals | — | 780 |
| Package Type | — | 780-ball FCBGA (H-BGA) |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Commercial C2 (0C to +85C) |
| Lead-Free (X suffix) | — | Yes |
| Configuration | — | Field Programmable Gate Array |