EP4SGX360KF40C2 vs EP4SGX360HF35I3 Perbandingan
Perbandingan bersamaan detil EP4SGX360KF40C2 dari Intel dan EP4SGX360HF35I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360KF40C2 | EP4SGX360HF35I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix IV GX | Stratix IV GX Field Programmable Gate Array |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | Yes (hard DSP blocks) |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | F35 |
| Suhu Kerja | 0C to +85C (commercial) | -40 °C to +100 °C (Industrial) |
| Paket | 1517-ball FCBGA, 42.5 x 42.5 mm | — |
| Tipe Mounting | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Level MSL | MSL3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| Total LABs | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| User I/Os | — | 564 |
| Package Type | — | 1152-Ball FCBGA (FineLine BGA) |
| I/O Standards Supported | — | LVDS, LVTTL, LVPECL, HSTL, SSTL |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Configuration Modes | — | Serial, Parallel, JTAG, Active Serial |