EP4SGX360KF40C2 vs EP4SGX360HF35I3 比較
詳細並排比較 EP4SGX360KF40C2 由 Intel 與 EP4SGX360HF35I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4SGX360KF40C2 | EP4SGX360HF35I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 啟用中 |
| Family | Stratix IV GX | Stratix IV GX Field Programmable Gate Array |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | Yes (hard DSP blocks) |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | F35 |
| 工作溫度 | 0C to +85C (commercial) | -40 °C to +100 °C (Industrial) |
| 封裝 | 1517-ball FCBGA, 42.5 x 42.5 mm | — |
| 安裝類型 | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| MSL 等級 | MSL3 (per JEDEC J-STD-020) | — |
| RoHS 狀態 | Compliant | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| Total LABs | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| User I/Os | — | 564 |
| Package Type | — | 1152-Ball FCBGA (FineLine BGA) |
| I/O Standards Supported | — | LVDS, LVTTL, LVPECL, HSTL, SSTL |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| Configuration Modes | — | Serial, Parallel, JTAG, Active Serial |