EPM2210F256C4N vs EPM2210F256A5NGA Perbandingan
Perbandingan bersamaan detil EPM2210F256C4N dari Intel dan EPM2210F256A5NGA dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM2210F256C4N | EPM2210F256A5NGA |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Device Type | CPLD | — |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | — |
| User Flash Memory | 204 Kbit | 8 Kbits (typical for MAX II family) |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | — |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | — |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | — |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| Rentang Suhu Kerja | 0 °C to +85 °C (Commercial) | 0C to +85C (NGA, commercial) |
| Paket | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (NGA) |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: rohs status from manufacturer] |
| Lead-Free | Yes | — |
| Logic Elements | — | 2210 |
| Macrocells | — | 1700 |
| Maximum Propagation Delay (tPD) | — | 7 ns (A5 speed grade) |
| User I/O Pins | — | 212 |
| Core Voltage | — | 1.8 V |
| Programmable Logic Blocks | — | 16 Logic Array Blocks |
| Configuration Method | — | On-chip Flash, in-system programmable via JTAG |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS (per bank) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free / halogen-free status] |