EPM2210F256C4N vs EPM2210F256A5NGA Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210F256C4N sa pamamagitan ng Intel at EPM2210F256A5NGA sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM2210F256C4N | EPM2210F256A5NGA |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | MAX II |
| Device Type | CPLD | — |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | — |
| User Flash Memory | 204 Kbit | 8 Kbits (typical for MAX II family) |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | — |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | — |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | — |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| Hanay ng Temperature na Operasyon | 0 °C to +85 °C (Commercial) | 0C to +85C (NGA, commercial) |
| Packhaging | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (NGA) |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: rohs status from manufacturer] |
| Lead-Free | Yes | — |
| Logic Elements | — | 2210 |
| Macrocells | — | 1700 |
| Maximum Propagation Delay (tPD) | — | 7 ns (A5 speed grade) |
| User I/O Pins | — | 212 |
| Core Voltage | — | 1.8 V |
| Programmable Logic Blocks | — | 16 Logic Array Blocks |
| Configuration Method | — | On-chip Flash, in-system programmable via JTAG |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS (per bank) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free / halogen-free status] |