EPM2210F256C4N vs EPM2210F256C3N Perbandingan

Perbandingan bersamaan detil EPM2210F256C4N dari Intel dan EPM2210F256C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EPM2210F256C4N EPM2210F256C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX II —
Device Type CPLD CPLD (Complex Programmable Logic Device)
Logic Elements (LE) 2210 —
Macro Cells 1700 —
User Flash Memory 204 Kbit 8 Kbits
Maximum Internal Frequency 247.5 MHz —
Pin-to-Pin Propagation Delay (tPD) 7.0 ns —
Maximum User I/O Pins 212 (varies with package) —
Global Clock Networks 4 —
Process Technology 0.18 µm 0.18 um flash CMOS
Core Supply Voltage 3.0 V to 3.6 V (3.3 V typical) —
MultiVolt I/O Standards 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz —
Rentang Suhu Kerja 0 °C to +85 °C (Commercial) —
Paket 256-ball FineLine BGA (FBGA) 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch
Programming Interface JTAG IEEE Std. 1149.1 + ISP —
Tipe Mounting Surface Mount (BGA) Surface Mount
Status RoHS Compliant Compliant (per DigiKey product page)
Lead-Free Yes —
Series — MAX II
Programmable Type — In System Programmable (JTAG, IEEE 1149.1)
Macrocells — 1700
Logic Elements / Blocks — 2210
Number of User I/Os — 204
Maximum Propagation Delay (tPD) — 7 ns
Maximum Internal Frequency (fMAX) — 304 MHz
Internal Supply Voltage — 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail)
I/O Standard Support — 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt)
Configuration Memory — On-chip flash (non-volatile, instant-on)
Suhu Hubung Kerja — 0 C to 85 C (commercial, TJ suffix 'C')
Level MSL — 3 (per JEDEC J-STD-020, typical for FBGA)

Spek dan Sumber

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