EPM2210F256C4N vs EPM2210F256C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210F256C4N disebabkan oleh Intel dan EPM2210F256C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPM2210F256C4N EPM2210F256C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX II —
Device Type CPLD CPLD (Complex Programmable Logic Device)
Logic Elements (LE) 2210 —
Macro Cells 1700 —
User Flash Memory 204 Kbit 8 Kbits
Maximum Internal Frequency 247.5 MHz —
Pin-to-Pin Propagation Delay (tPD) 7.0 ns —
Maximum User I/O Pins 212 (varies with package) —
Global Clock Networks 4 —
Process Technology 0.18 µm 0.18 um flash CMOS
Core Supply Voltage 3.0 V to 3.6 V (3.3 V typical) —
MultiVolt I/O Standards 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz —
Gambaran Suhu Operasi 0 °C to +85 °C (Commercial) —
Kemasan 256-ball FineLine BGA (FBGA) 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch
Programming Interface JTAG IEEE Std. 1149.1 + ISP —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Status RoHS Compliant Compliant (per DigiKey product page)
Lead-Free Yes —
Series — MAX II
Programmable Type — In System Programmable (JTAG, IEEE 1149.1)
Macrocells — 1700
Logic Elements / Blocks — 2210
Number of User I/Os — 204
Maximum Propagation Delay (tPD) — 7 ns
Maximum Internal Frequency (fMAX) — 304 MHz
Internal Supply Voltage — 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail)
I/O Standard Support — 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt)
Configuration Memory — On-chip flash (non-volatile, instant-on)
Suhu Hubungan Operasi — 0 C to 85 C (commercial, TJ suffix 'C')
Aras MSL — 3 (per JEDEC J-STD-020, typical for FBGA)

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