EPM2210F256C4N vs EPM2210F256C5N Perbandingan
Perbandingan bersamaan detil EPM2210F256C4N dari Intel dan EPM2210F256C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM2210F256C4N | EPM2210F256C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Device Type | CPLD | — |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | — |
| User Flash Memory | 204 Kbit | — |
| Maximum Internal Frequency | 247.5 MHz | 201.1 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | — |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | 0.18 um CMOS with on-chip flash |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | — |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| Rentang Suhu Kerja | 0 °C to +85 °C (Commercial) | — |
| Paket | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (17x17mm, 1mm pitch) |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 2210 |
| Macrocells | — | 1700 |
| User I/Os | — | 204 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Propagation Delay (tPD) | — | 7 ns |
| Turn-On Delay (tSU) | — | 11.2 ns |
| Supply Voltage (VCCINT) | — | 2.375 V to 3.6 V (3.3 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Global Clocks | — | 4 |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Configuration Memory | — | Internal flash (non-volatile, instant-on) |