EPM2210F256C4N vs EPM2210F256C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210F256C4N disebabkan oleh Intel dan EPM2210F256C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM2210F256C4N | EPM2210F256C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Device Type | CPLD | — |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | — |
| User Flash Memory | 204 Kbit | — |
| Maximum Internal Frequency | 247.5 MHz | 201.1 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | — |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | 0.18 um CMOS with on-chip flash |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | — |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| Gambaran Suhu Operasi | 0 °C to +85 °C (Commercial) | — |
| Kemasan | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (17x17mm, 1mm pitch) |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 2210 |
| Macrocells | — | 1700 |
| User I/Os | — | 204 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Propagation Delay (tPD) | — | 7 ns |
| Turn-On Delay (tSU) | — | 11.2 ns |
| Supply Voltage (VCCINT) | — | 2.375 V to 3.6 V (3.3 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Global Clocks | — | 4 |
| Suhu Operasi | — | 0C to +85C (commercial) |
| Configuration Memory | — | Internal flash (non-volatile, instant-on) |