EPM240F100C5N vs EPM240GT100C3 Perbandingan
Perbandingan bersamaan detil EPM240F100C5N dari Intel dan EPM240GT100C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM240F100C5N | EPM240GT100C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | MAX II | — |
| Logic Elements (LEs) | 240 | — |
| Macrocells | 192 | — |
| User I/O Pins (maximum) | 80 | — |
| Pin-to-Pin Logic Delay (tPD) | 4.7 ns | — |
| Maximum Operating Frequency | [DATA_NEEDED: fmax per datasheet] | — |
| Global Clock Networks | [DATA_NEEDED: count] | — |
| Paket | 100-ball FineLine BGA (FBGA-100) | TQFP-100 (100-TQFP, 16 × 16 mm, 0.5 mm pitch) |
| Rentang Suhu Kerja | 0C to +85C (commercial) | — |
| Supply Voltage Core (VCCINT) | 3.3 V | — |
| I/O Bank Voltage (VCCIO) | 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) | — |
| Configuration Memory | Non-volatile flash (instant-on) | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| Programming Interface | JTAG / ByteBlasterMV | IEEE 1149.1 JTAG (ISP) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Family | — | MAX II |
| Logic Elements (LE) | — | 240 |
| Equivalent Macro Cells | — | 192 |
| Pin-to-Pin Delay (tPD) | — | 4.7 ns |
| Maximum Internal Frequency (fMAX) | — | 304 MHz |
| User I/O Count | — | 80 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Process Technology | — | 0.18 µm 6-layer-metal flash |
| Core Supply Voltage | — | 1.8 V (internal) |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Suhu Kerja | — | 0 °C to 85 °C (commercial, C3 suffix) |
| Level MSL | — | 3 (168 hours) |