EPM240F100C5N vs EPM240GT100C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM240F100C5N disebabkan oleh Intel dan EPM240GT100C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM240F100C5N | EPM240GT100C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | MAX II | — |
| Logic Elements (LEs) | 240 | — |
| Macrocells | 192 | — |
| User I/O Pins (maximum) | 80 | — |
| Pin-to-Pin Logic Delay (tPD) | 4.7 ns | — |
| Maximum Operating Frequency | [DATA_NEEDED: fmax per datasheet] | — |
| Global Clock Networks | [DATA_NEEDED: count] | — |
| Kemasan | 100-ball FineLine BGA (FBGA-100) | TQFP-100 (100-TQFP, 16 × 16 mm, 0.5 mm pitch) |
| Gambaran Suhu Operasi | 0C to +85C (commercial) | — |
| Supply Voltage Core (VCCINT) | 3.3 V | — |
| I/O Bank Voltage (VCCIO) | 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) | — |
| Configuration Memory | Non-volatile flash (instant-on) | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| Programming Interface | JTAG / ByteBlasterMV | IEEE 1149.1 JTAG (ISP) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Family | — | MAX II |
| Logic Elements (LE) | — | 240 |
| Equivalent Macro Cells | — | 192 |
| Pin-to-Pin Delay (tPD) | — | 4.7 ns |
| Maximum Internal Frequency (fMAX) | — | 304 MHz |
| User I/O Count | — | 80 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Process Technology | — | 0.18 µm 6-layer-metal flash |
| Core Supply Voltage | — | 1.8 V (internal) |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Suhu Operasi | — | 0 °C to 85 °C (commercial, C3 suffix) |
| Aras MSL | — | 3 (168 hours) |