EPM570F256C3 vs EPM570F256C3N Perbandingan
Perbandingan bersamaan detil EPM570F256C3 dari Intel dan EPM570F256C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570F256C3 | EPM570F256C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements / Macro Cells | 440 Logic Elements (~570 macro cells equivalent) | — |
| Maximum Operating Frequency | 304 MHz | 304 MHz |
| Propagation Delay (tPD) | [DATA_NEEDED: tPD in ns] | — |
| User I/O Count | 80 (max for F256 package) | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| User Flash Memory | 8 Kbits | — |
| Supply Voltage - Core | 2.5 V / 3.3 V (MultiVolt core) | — |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.18 µm | 0.18 um, 6-layer-metal flash CMOS |
| Paket | 256-FBGA (FineLine BGA) 17 × 17 mm | 256-ball FBGA (FineLine BGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) - ISP | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Configuration Memory | Non-volatile on-chip flash | — |
| Suhu Kerja | Commercial: 0 °C to +85 °C (C3 grade) | — |
| Status RoHS | Compliant | Compliant (per DigiKey listing) |
| Lead-Free | Yes | Yes (per suffix 'N' convention) |
| Design Software | Quartus II / Quartus Prime (legacy support) | — |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Level MSL | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |