EPM570F256C3 vs EPM570F256C3N 比較

詳細並排比較 EPM570F256C3 由 Intel 與 EPM570F256C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EPM570F256C3 EPM570F256C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family MAX II MAX II
Device Type CPLD (Complex Programmable Logic Device) —
Logic Elements / Macro Cells 440 Logic Elements (~570 macro cells equivalent) —
Maximum Operating Frequency 304 MHz 304 MHz
Propagation Delay (tPD) [DATA_NEEDED: tPD in ns] —
User I/O Count 80 (max for F256 package) [DATA_NEEDED: confirm exact user-IO count for F256 package]
User Flash Memory 8 Kbits —
Supply Voltage - Core 2.5 V / 3.3 V (MultiVolt core) —
Supply Voltage - I/O 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) —
Process Technology 0.18 µm 0.18 um, 6-layer-metal flash CMOS
封裝 256-FBGA (FineLine BGA) 17 × 17 mm 256-ball FBGA (FineLine BGA)
安裝類型 Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1) - ISP JTAG (IEEE 1532 / IEEE 1149.1) + ISP
Configuration Memory Non-volatile on-chip flash —
工作溫度 Commercial: 0 °C to +85 °C (C3 grade) —
RoHS 狀態 Compliant Compliant (per DigiKey listing)
Lead-Free Yes Yes (per suffix 'N' convention)
Design Software Quartus II / Quartus Prime (legacy support) —
Logic Elements (LEs) — 570
Equivalent Macrocells — 440
User Flash Memory (UFM) — 8 Kbits
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
MSL 等級 — [DATA_NEEDED: MSL level not stated in provided data]
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

資料表與資源

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