EPM570F256I5 vs EPM570F256C4N Perbandingan
Perbandingan bersamaan detil EPM570F256I5 dari Intel dan EPM570F256C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570F256I5 | EPM570F256C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | MAX II | — |
| Logic Elements (LE) | 570 | — |
| Maximum User I/O Pins | 160 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbit |
| Number of LABs/CLBs | [DATA_NEEDED: number of LABs] | — |
| Package Type | 256-ball FineLine BGA (FBGA-256) | — |
| Suhu Kerja | -40C to +85C (industrial) | — |
| Supply Voltage - Core | 3.3 V (also operates at 3.3V per part description) | — |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, PCI | — |
| MultiVolt I/O | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | — |
| In-System Programmability | Yes | — |
| Non-volatile Configuration | Yes (on-chip flash) | — |
| Pin-to-Pin Logic Delay (typ) | 5 ns to 7 ns | — |
| Maximum Internal Frequency | [DATA_NEEDED: fMAX MHz per speed grade] | 304 MHz |
| Number of PLLs | [DATA_NEEDED: number of PLLs] | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Width | 17 mm (per Partstack) | — |
| Speed Grade | I5 | — |
| Series | — | MAX II |
| Logic Elements | — | 570 LE |
| Macrocells | — | 440 |
| Logic Array Blocks (LABs) | — | 57 |
| User I/O Count | — | 160 |
| Paket | — | 256-ball FineLine BGA (FBGA) |
| Package Size | — | 17 mm × 17 mm |
| Process Technology | — | 0.18 µm 6-layer-metal flash |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Rentang Suhu Kerja | — | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | — | Yes (JTAG) |