EPM570GF256C4 vs EPM570F256C4N Perbandingan
Perbandingan bersamaan detil EPM570GF256C4 dari Intel dan EPM570F256C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570GF256C4 | EPM570F256C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | — |
| Logic Elements (LEs) | 570 | — |
| Macrocells | 440 | 440 |
| Maximum User I/Os | 212 | — |
| Pin-to-Pin Delay (tPD) | 5.4 ns | — |
| Supply Voltage VCCINT | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) | — |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) | — |
| Suhu Kerja | 0 °C to +85 °C (commercial) | — |
| Paket | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (FBGA) |
| Ball Pitch | 1.0 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Technology | 0.18 µm CMOS, flash-based configuration | 0.18 µm 6-layer-metal flash |
| JTAG Support | IEEE 1149.1 boundary-scan + ISP | — |
| Configuration Memory | Non-volatile flash (instant-on, no boot PROM) | — |
| Status RoHS | Lead-free, RoHS compliant | Compliant |
| Series | — | MAX II |
| Logic Elements | — | 570 LE |
| Logic Array Blocks (LABs) | — | 57 |
| User I/O Count | — | 160 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Package Size | — | 17 mm × 17 mm |
| Maximum Internal Frequency | — | 304 MHz |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Rentang Suhu Kerja | — | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | — | Yes (JTAG) |