EPM570GF256C4 vs EPM570F256C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570GF256C4 disebabkan oleh Intel dan EPM570F256C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570GF256C4 | EPM570F256C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | — |
| Logic Elements (LEs) | 570 | — |
| Macrocells | 440 | 440 |
| Maximum User I/Os | 212 | — |
| Pin-to-Pin Delay (tPD) | 5.4 ns | — |
| Supply Voltage VCCINT | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) | — |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) | — |
| Suhu Operasi | 0 °C to +85 °C (commercial) | — |
| Kemasan | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (FBGA) |
| Ball Pitch | 1.0 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Process Technology | 0.18 µm CMOS, flash-based configuration | 0.18 µm 6-layer-metal flash |
| JTAG Support | IEEE 1149.1 boundary-scan + ISP | — |
| Configuration Memory | Non-volatile flash (instant-on, no boot PROM) | — |
| Status RoHS | Lead-free, RoHS compliant | Compliant |
| Series | — | MAX II |
| Logic Elements | — | 570 LE |
| Logic Array Blocks (LABs) | — | 57 |
| User I/O Count | — | 160 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Package Size | — | 17 mm × 17 mm |
| Maximum Internal Frequency | — | 304 MHz |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Gambaran Suhu Operasi | — | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | — | Yes (JTAG) |