H5AN8G8NAFR-RDC vs H5AN8G8NAFR-VKC Perbandingan
Perbandingan bersamaan detil H5AN8G8NAFR-RDC dari SK hynix dan H5AN8G8NAFR-VKC dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5AN8G8NAFR-RDC | H5AN8G8NAFR-VKC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| Organisasi | 1G x 8 (x8) | 1G x 8 |
| Antarmuka | DDR4 (Double Data Rate 4) | SSTL12 |
| Speed Grade | -RDC (DDR4-2666 class) | DDR4-2666 (VKC bin) |
| Laju Data | 2666 MT/s (per -R speed grade suffix) | — |
| Core Supply Voltage (VDD) | 1.2 V | — |
| I/O Supply Voltage (VDDQ) | 1.2 V | — |
| Wordline Supply (VPP) | 2.5 V | — |
| Banks / Bank Groups | 16 banks / 4 bank groups (DDR4 8Gb architecture) | — |
| Burst Length | 8 (BL8) | 8 (BL8) |
| Latensi CAS | [DATA_NEEDED: CAS Latency] | — |
| Paket | 78-ball FBGA | 78-ball FBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | [DATA_NEEDED: Operating Temperature range] | [DATA_NEEDED: operating temperature range] |
| Lead-Free | Yes | — |
| Bebas Halogen | Yes | — |
| Status RoHS | Compliant | Compliant (Lead-Free & Halogen-Free) |
| Datasheet Revision | Rev. 1.2 / Jul. 2017 | — |
| Supply Voltage (VDD) | — | 1.2 V |
| Bank Group Architecture | — | Supported (per DDR4 JEDEC architecture) |
| On-Die Termination (ODT) | — | Yes |
| DLL | — | Yes (DLL for output skew control) |
| Process Technology | — | CMOS |
| Recommended Application | — | Main memory requiring large density and high bandwidth |