H5ANAG6NBJR-UHC vs H5ANAG6NBJR-PBC Perbandingan
Perbandingan bersamaan detil H5ANAG6NBJR-UHC dari SK hynix dan H5ANAG6NBJR-PBC dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5ANAG6NBJR-UHC | H5ANAG6NBJR-PBC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | DRAM | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 16 Gb (2 GB) |
| Organisasi | 256M x 16 | [DATA_NEEDED: Organization x16/x8] |
| Antarmuka | DDR4 (CMOS) | — |
| Paket | PBGA96 / FBGA-96 (TFBGA) | FBGA-96 |
| Package Dimensions | 13 mm length (per JESD-30 R-PBGA-B96) | — |
| Access Mode | Multi Bank, Page Burst | — |
| Suhu Kerja | -40C to +95C | [DATA_NEEDED: Operating Temperature] |
| Refresh | Auto / Self Refresh | — |
| Data Mask | Supported (DM function) | — |
| Asynchronous Reset | Supported | Yes |
| On-Chip Termination | Dynamic ODT | Dynamic ODT |
| ZQ Calibration | Supported | Yes |
| Write Leveling | Supported | Yes |
| CRC | Supported | — |
| Supply Voltage Class | DDR4 (1.2 V class) | — |
| Status RoHS | RoHS Compliant | [DATA_NEEDED: RoHS Status] |
| REACH Compliance | Compliant | — |
| ECCN | EAR99 | — |
| HTS Code | 8542.32.00.36 | — |
| Latensi CAS | [DATA_NEEDED: CAS Latency] | — |
| Max Data Rate | [DATA_NEEDED: Max Data Rate] | — |
| Tegangan Pemuat | — | 1.2 V |
| Generation Max Data Rate | — | 3200 MT/s (family max) |
| Tipe Mounting | — | Surface Mount |
| Self Refresh | — | Auto self-refresh |
| Data Mask Function | — | Yes |
| CRC Function | — | Yes |
| Speed Bin (PBC) | — | [DATA_NEEDED: Speed grade MT/s] |