H5CG34MEBDX030N vs H5CG34MEBDX030 Perbandingan

Perbandingan bersamaan detil H5CG34MEBDX030N dari SK hynix dan H5CG34MEBDX030 dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

SK hynix
H5CG34MEBDX030 H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum H5CG34MEBDX030N H5CG34MEBDX030
Merek SK hynix SK hynix
Kategori DDR5 DRAM
Status Lingkungan Hidup Aktif Aktif
Manufacturer SK hynix SK hynix
Product Type DDR5 SDRAM Component —
Density 16 Gbit (2 GB) [DATA_NEEDED: device density (Gb)]
Memory Series H5CG3 series (B-die) —
DRAM Process Node 1b-nanometer-class —
Supply Voltage VDD/VDDQ 1.1 V —
Wordline Boost Supply VPP 1.8 V —
Antarmuka DDR5 (JEDEC double data rate 5) —
Organisasi x8 or x16 configuration [DATA_NEEDED: exact bus width] [DATA_NEEDED: x organization]
Data Rate Class [DATA_NEEDED: speed grade per -030 suffix] —
On-Die ECC Yes (DDR5 ODECC) —
Sub-Channel Architecture Dual independent 32/40-bit sub-channels —
Package Type FBGA surface mount —
Suhu Kerja [DATA_NEEDED: commercial/industrial range] [DATA_NEEDED: operating temperature range]
ECC Feature On-die ECC, no host overhead —
Typical Application Server RDIMM / LRDIMM components —
Product Family — H5CG (DDR5 SDRAM)
Tipe Memori — DDR5 SDRAM
Speed Grade / Data Rate — [DATA_NEEDED: MT/s speed bin]
CAS Latency (CL) — [DATA_NEEDED: CL value]
Supply Voltage VDD — [DATA_NEEDED: VDD (typ. 1.1 V class for DDR5)]
Paket — FBGA (fine-pitch BGA), surface mount
Tipe Mounting — Surface Mount
On-die ECC — Yes (DDR5 standard feature)
Burst Length — 16 (DDR5 standard)
Bank Groups — [DATA_NEEDED: bank group count]
Tipe Antarmuka — Parallel, DDR5 point-to-point
Status RoHS — Compliant
Level MSL — [DATA_NEEDED: moisture sensitivity level]

Spek dan Sumber

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