H5CG34MEBDX030N vs H5CG34MEBDX030 比較

詳細並排比較 H5CG34MEBDX030N 由 SK hynix 與 H5CG34MEBDX030 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5CG34MEBDX030 H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 ✓ 啟用中

規格比較

參數 H5CG34MEBDX030N H5CG34MEBDX030
品牌 SK hynix SK hynix
類別 DDR5 DRAM
生命週期狀態 啟用中 啟用中
Manufacturer SK hynix SK hynix
Product Type DDR5 SDRAM Component —
Density 16 Gbit (2 GB) [DATA_NEEDED: device density (Gb)]
Memory Series H5CG3 series (B-die) —
DRAM Process Node 1b-nanometer-class —
Supply Voltage VDD/VDDQ 1.1 V —
Wordline Boost Supply VPP 1.8 V —
介面 DDR5 (JEDEC double data rate 5) —
組織 x8 or x16 configuration [DATA_NEEDED: exact bus width] [DATA_NEEDED: x organization]
Data Rate Class [DATA_NEEDED: speed grade per -030 suffix] —
On-Die ECC Yes (DDR5 ODECC) —
Sub-Channel Architecture Dual independent 32/40-bit sub-channels —
Package Type FBGA surface mount —
工作溫度 [DATA_NEEDED: commercial/industrial range] [DATA_NEEDED: operating temperature range]
ECC Feature On-die ECC, no host overhead —
Typical Application Server RDIMM / LRDIMM components —
Product Family — H5CG (DDR5 SDRAM)
記憶體類型 — DDR5 SDRAM
Speed Grade / Data Rate — [DATA_NEEDED: MT/s speed bin]
CAS Latency (CL) — [DATA_NEEDED: CL value]
Supply Voltage VDD — [DATA_NEEDED: VDD (typ. 1.1 V class for DDR5)]
封裝 — FBGA (fine-pitch BGA), surface mount
安裝類型 — Surface Mount
On-die ECC — Yes (DDR5 standard feature)
Burst Length — 16 (DDR5 standard)
Bank Groups — [DATA_NEEDED: bank group count]
介面類型 — Parallel, DDR5 point-to-point
RoHS 狀態 — Compliant
MSL 等級 — [DATA_NEEDED: moisture sensitivity level]

資料表與資源

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