IRFB3207ZPBF vs IRF3007STRLPBF Perbandingan
Perbandingan bersamaan detil IRFB3207ZPBF dari Infineon dan IRF3007STRLPBF dari Infineon. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | IRFB3207ZPBF | IRF3007STRLPBF |
|---|---|---|
| Merek | Infineon | Infineon |
| Kategori | MOSFETs | MOSFETs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Infineon Technologies (formerly International Rectifier) | — |
| Part Number | IRFB3207ZPBF | — |
| Series | HEXFET | — |
| Technology | N-Channel MOSFET (HEXFET, Z-suffix ruggedized) | — |
| Drain-Source Voltage (VDS) | 75 V | — |
| Continuous Drain Current (ID) at TC=25C | 120 A | — |
| Silicon-Limited Drain Current | 170 A | — |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: pulsed drain current value] | — |
| On-Resistance RDS(on) typ @ VGS=10V | 3.3 mOhm | — |
| On-Resistance RDS(on) max @ VGS=10V | 4.1 mOhm | — |
| Gate Threshold Voltage VGS(th) | [DATA_NEEDED: typical VGS(th)] | — |
| Total Gate Charge Qg | [DATA_NEEDED: total gate charge] | — |
| Power Dissition (PD) at TC=25C | 300 W | — |
| Suhu Hubung Kerja | -55 C to +175 C | -55°C to +175°C |
| Paket | TO-220AB (3-lead through-hole) | — |
| Tipe Mounting | Through Hole | Surface Mount |
| Lead-Free / RoHS | Yes (PBF suffix = lead-free) | — |
| Level MSL | N/A (through-hole) | — |
| Avalanche Rated | Yes (improved Z-variant ruggedness) | Yes (Repetitive Avalanche Allowed up to Tjmax) |
| Polarity | — | N-Channel |
| MOSFET Operating Mode | — | Enhancement |
| Drain-to-Source Breakdown Voltage (V(BR)DSS) | — | 75 V |
| Continuous Drain Current (Id) at Tc=25°C | — | 62 A |
| Pulsed Drain Current (Idm) | — | 250 A |
| Static Drain-to-Source On-Resistance (RDS(on)) | — | 12.6 mΩ typical at VGS=10V |
| Gate-to-Source Threshold Voltage (VGS(th)) | — | 2.0 V to 4.0 V |
| Total Gate Charge (Qg) | — | 110 nC typical |
| Maximum Power Dissipation (Pd) | — | 120 W at Tc=25°C |
| Thermal Resistance Junction-to-Case (RθJC) | — | 1.0 °C/W |
| Thermal Resistance Junction-to-Ambient (RθJA) | — | 40 °C/W |
| Package Type | — | D2PAK (TO-263), 3-pin (2+Tab), Surface Mount |
| Status RoHS | — | Compliant (Lead-Free, PBF suffix) |