K4A4G045WD-BCRC vs K4A4G085WG-BCWE Perbandingan
Perbandingan bersamaan detil K4A4G045WD-BCRC dari Samsung Electronics dan K4A4G085WG-BCWE dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4A4G045WD-BCRC | K4A4G085WG-BCWE |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | DRAM | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM (Volatile) |
| Density | 4 Gb | — |
| Organisasi | 1G x4 | — |
| Die Generation | D-die | — |
| Supply Voltage VDD | 1.2 V | — |
| Speed Grade / Data Rate | BCRC (2400 Mbps per Samsung product selection guide) | — |
| Paket | TFBGA-78 (FBGA-78) | FBGA-78 (BCW) |
| Number of Terminals | 78 | — |
| Self Refresh | Yes | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Temperature Grade | [DATA_NEEDED: operating temperature range] | — |
| Clock Frequency | [DATA_NEEDED: CK frequency for BCRC bin] | — |
| Latensi CAS | [DATA_NEEDED: CL for BCRC bin] | — |
| Bank Architecture | DDR4 8 internal banks with bank groups | — |
| Refresh | Self refresh supported (per Partstack listing) | [DATA_NEEDED: refresh rate specification] |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead Free Status | [DATA_NEEDED: lead-free status] | — |
| Packaging Option | [DATA_NEEDED: tape and reel quantity] | — |
| Ukuran Memori | — | 4 Gb |
| Memory Organization | — | 512M x 8 |
| Laju Data | — | 3200 Mbps/pin |
| Speed Class | — | DDR4-3200 |
| Supply Voltage (VDD) | — | 1.2 V |
| Technology | — | D-die DDR4 |
| Antarmuka | — | Parallel (DDR4) |
| Burst Length | — | BL8 |
| DLL Mode | — | DLL Enabled (per datasheet timing) |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |