K4A8G085WC-BCRC vs K4A8G165WB-BCRC Perbandingan
Perbandingan bersamaan detil K4A8G085WC-BCRC dari Samsung Electronics dan K4A8G165WB-BCRC dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4A8G085WC-BCRC | K4A8G165WB-BCRC |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | DRAM | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM (DRAM, volatile) |
| Density | 8 Gbit | — |
| Organisasi | 1G x 8 | — |
| Tegangan Pemuat | 1.2 V | — |
| Laju Data | 2400 Mbps (DDR4-2400) | 2400 Mbps/pin (DDR4-2400) |
| Paket | 78-ball FBGA (TFBGA) | 96-ball FBGA (PBGA96) |
| Terminal Pitch | 0.8 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | 0C to +95C | -40C to +95C |
| Auto Precharge | Yes | Yes |
| Asynchronous Reset | Yes | Yes |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | Yes |
| Dynamic On-Die Termination | Yes | — |
| Data Mask Function | Yes | — |
| Status RoHS | Compliant | — |
| Refresh | Auto/Self refresh | — |
| Ukuran Memori | — | 8 Gb |
| Memory Organization | — | 512M x 16 |
| Antarmuka | — | Parallel (DDR4 SDRAM bus) |
| Supply Voltage (VDD) | — | 1.2 V |
| Technology | — | CMOS, B-die 8Gb die |
| CRC / CA Parity | — | CRC function supported |
| On-Chip Termination | — | Dynamic ODT |
| Clock Frequency | — | 1200 MHz (DDR4-2400) |