K4A8G165WB-BCWE vs K4A8G165WB-BCTD Perbandingan

Perbandingan bersamaan detil K4A8G165WB-BCWE dari Samsung Electronics dan K4A8G165WB-BCTD dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Samsung Electronics
K4A8G165WB-BCWE K4A8G165WB-BCWE - 8Gb DDR4 3200Mbps 96FBGA DRAM | Samsung

K4A8G165WB-BCWE - 8Gb DDR4 3200Mbps 96FBGA DRAM | Samsung

K4A8G165WB-BCWE ✓ Aktif
Samsung Electronics
K4A8G165WB-BCTD K4A8G165WB-BCTD - 8Gb DDR4 SDRAM 512Mx16 2666Mbps | Samsung

K4A8G165WB-BCTD - 8Gb DDR4 SDRAM 512Mx16 2666Mbps | Samsung

K4A8G165WB-BCTD ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum K4A8G165WB-BCWE K4A8G165WB-BCTD
Merek Samsung Electronics Samsung Electronics
Kategori Memory ICs DRAM
Status Lingkungan Hidup Aktif Aktif
Status Stok In Stock —
Harga Unit (USD) $6,25 —
Tipe Memori DDR4 SDRAM DDR4 SDRAM
Ukuran Memori 8 Gb —
Memory Organization 512M x 16 —
Laju Data 3200 Mbps/pin 2666 Mbps
Tegangan Pemuat 1.2 V —
Access Time 19 ns —
Antarmuka Parallel DDR4 (parallel, double data rate)
Paket 96FBGA 96FBGA
Suhu Kerja 0C to +85C 0C to +85C
Tipe Mounting Surface Mount Surface Mount (BGA)
Memory Format DRAM (volatile) —
Technology DDR4 SDRAM B-die —
Prefetch 8n —
Refresh Self-refresh supported —
Termination On-die termination (ODT) —
Status RoHS [DATA_NEEDED: RoHS compliance statement] Compliant (per JLCPCB listing: ROHS)
Level MSL [DATA_NEEDED: moisture sensitivity level] —
Density — 8 Gb
Organisasi — 512M x 16
Supply Voltage (VDD) — 1.2 V
Die Generation — B-die
Data Mask — Supported (DM per x16 lane)
ZQ Calibration — Supported
Dynamic On-Die Termination — Supported
Latensi CAS — [DATA_NEEDED: CAS Latency]
Refresh Rate — [DATA_NEEDED: Refresh Rate]
Moisture Sensitivity Level — [DATA_NEEDED: MSL Level]

Spek dan Sumber

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