LPC55S26JBD64K vs LPC55S26JBD64Y Perbandingan
Perbandingan bersamaan detil LPC55S26JBD64K dari NXP Semiconductors dan LPC55S26JBD64Y dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | LPC55S26JBD64K | LPC55S26JBD64Y |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | ARM Cortex-M33 | ARM Cortex-M33 |
| Core Size | 32-Bit | 32-Bit |
| Frekuensi Bawah Maximum | 150 MHz | 150 MHz |
| Flash Memory Size | 256 KB (256K x 8) | — |
| RAM Size | 144 KB (144K x 8) | — |
| Security Features | ARM TrustZone (secure LPC55S2x variant) | — |
| Memory Protection Unit | Yes (MPU) | — |
| Interrupt Controller | NVIC with NMI input (selectable sources) | — |
| Paket | 64-HTQFP (10 x 10 mm) | 64-HTQFP (10 x 10 mm), exposed pad |
| Tipe Mounting | Surface Mount | Surface Mount (Gull Wing terminals) |
| Suhu Kerja | -40C to +105C (TA) | — |
| Tegangan Pemuat | [DATA_NEEDED: supply voltage range] | 3.3 V |
| Number of I/O | [DATA_NEEDED: GPIO count] | — |
| Peripherals | [DATA_NEEDED: peripheral list] | — |
| Packaging | Tray | — |
| Series | LPC55S2x (EdgeVerse platform) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Program Flash Memory | — | 256 KB (256K x 8) |
| Temperature Grade | — | Industrial |
| Product Series | — | LPC552x / LPC55S2x |
| Process Technology | — | 40-nm NVM |
| Number of Terminals | — | 64 |
| Package Shape | — | Square |
| SRAM Size | — | [DATA_NEEDED: SRAM size] |
| Rentang Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Peripheral Compatibility | — | Pin-, software- and peripheral-compatible with LPC552x/S2x family |