LPC55S26JBD64K vs LPC55S26JBD64Y 比較

詳細並排比較 LPC55S26JBD64K 由 NXP Semiconductors 與 LPC55S26JBD64Y 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
LPC55S26JBD64K LPC55S26JBD64K - 150MHz Cortex-M33 MCU 256KB Flash | NXP

LPC55S26JBD64K - 150MHz Cortex-M33 MCU 256KB Flash | NXP

LPC55S26JBD64K ✓ 啟用中
NXP Semiconductors
LPC55S26JBD64Y LPC55S26JBD64Y - 150MHz Cortex-M33 MCU 256KB | NXP

LPC55S26JBD64Y - 150MHz Cortex-M33 MCU 256KB | NXP

LPC55S26JBD64Y ✓ 啟用中

規格比較

參數 LPC55S26JBD64K LPC55S26JBD64Y
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core Processor ARM Cortex-M33 ARM Cortex-M33
Core Size 32-Bit 32-Bit
最大時脈頻率 150 MHz 150 MHz
Flash Memory Size 256 KB (256K x 8) —
RAM Size 144 KB (144K x 8) —
Security Features ARM TrustZone (secure LPC55S2x variant) —
Memory Protection Unit Yes (MPU) —
Interrupt Controller NVIC with NMI input (selectable sources) —
封裝 64-HTQFP (10 x 10 mm) 64-HTQFP (10 x 10 mm), exposed pad
安裝類型 Surface Mount Surface Mount (Gull Wing terminals)
工作溫度 -40C to +105C (TA) —
供應電壓 [DATA_NEEDED: supply voltage range] 3.3 V
Number of I/O [DATA_NEEDED: GPIO count] —
Peripherals [DATA_NEEDED: peripheral list] —
Packaging Tray —
Series LPC55S2x (EdgeVerse platform) —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Program Flash Memory — 256 KB (256K x 8)
Temperature Grade — Industrial
Product Series — LPC552x / LPC55S2x
Process Technology — 40-nm NVM
Number of Terminals — 64
Package Shape — Square
SRAM Size — [DATA_NEEDED: SRAM size]
工作溫度範圍 — [DATA_NEEDED: operating temperature range]
Peripheral Compatibility — Pin-, software- and peripheral-compatible with LPC552x/S2x family

資料表與資源

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