M29F160FB55N3F2 vs M29W160ET70N3E Perbandingan

Perbandingan bersamaan detil M29F160FB55N3F2 dari Micron Technology dan M29W160ET70N3E dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Micron Technology
M29F160FB55N3F2 M29F160FB55N3F2 - 16Mbit 5V NOR Flash 55ns | Micron

M29F160FB55N3F2 - 16Mbit 5V NOR Flash 55ns | Micron

M29F160FB55N3F2 Obsolete
Micron Technology
M29W160ET70N3E M29W160ET70N3E - 16Mb 3V Parallel NOR Flash 70ns TSOP48 | Micron

M29W160ET70N3E - 16Mb 3V Parallel NOR Flash 70ns TSOP48 | Micron

M29W160ET70N3E ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum M29F160FB55N3F2 M29W160ET70N3E
Merek Micron Technology Micron Technology
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Obsolete Aktif
Tipe Memori Parallel NOR Flash NOR Flash (Parallel)
Density 16777 kbits (16 Mbit) —
Organisasi 1 Mword x 16 bits / 2 Mbyte x 8 bits 2M x 8 / 1M x 16
Number of Words 1000 k —
Bits per Word 16 bits —
Access Time 55 ns 70 ns
Tegangan Pemuat 5 V 3 V / 3.3 V (nominal)
Boot Block Architecture Bottom Boot Block —
Suhu Kerja -40 to +125 C [DATA_NEEDED: operating temperature range]
Antarmuka Parallel Parallel
Package Type 48-TSOP —
Tipe Mounting Surface Mount Surface Mount
Termination Finish Lead-free (F2 suffix) —
Program/Erase Controller Embedded byte/word program algorithms —
Block Protection Hardware boot block protection —
Status RoHS Compliant (lead-free) Compliant (E suffix)
Speed Grade (from MPN) 55 (55 ns) —
Ukuran Memori — 16 Mbit
Boot Block Location — Top boot
Paket — 48-TSOP
Automotive Qualification — AEC-Q100 qualified
Bus Width Selection — BYTE# pin, x8 or x16
Sector Protection — Hardware boot block protection
Programming Type — Automatic program and erase
Packing — Tray (RoHS-compliant package, standard packing)
Endurance — [DATA_NEEDED: program/erase cycles]
Data Retention — [DATA_NEEDED: data retention]

Spek dan Sumber

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