M29W128GH70ZS3E vs M29W128GL70ZA3E Perbandingan
Perbandingan bersamaan detil M29W128GH70ZS3E dari Micron Technology dan M29W128GL70ZA3E dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | M29W128GH70ZS3E | M29W128GL70ZA3E |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | Parallel NOR Flash (SLC) | NOR Flash |
| Density | 128 Mbit (16 MB) | 128 Mbit |
| Organisasi | 8M x16 (x8/x16 capable family) | 16M x 8 / 8M x 16 |
| Access Time | 70 ns | 70 ns |
| Tegangan Pemuat | 2.7 V to 3.6 V | 3V / 3.3V |
| Antarmuka | Parallel, Asynchronous | Parallel |
| Boot Block | Top Boot Block | — |
| Suhu Kerja | -40C to +125C | -40C to +125C |
| Paket | 64-FBGA (11 x 13 mm), LBGA | 64-TBGA (10x13 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Technology | NOR Flash, SLC | — |
| Common Flash Interface | Yes | — |
| Block Protection | Hardware/Software block protection | — |
| Automotive Temperature Grade | Yes (-40C to +125C) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Boot Block Location | — | Bottom boot (GL variant) |
| Bus Width Selection | — | BYTE pin (x8/x16) |
| Packaging | — | Tray |
| Product Longevity Program | — | No |
| FBGA Code | — | [DATA_NEEDED: FBGA Code] |
| Program/Erase Endurance | — | [DATA_NEEDED: Program/Erase Endurance] |