M29W128GH70ZS3E vs M29W128GL70ZA3E Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M29W128GH70ZS3E disebabkan oleh Micron Technology dan M29W128GL70ZA3E disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | M29W128GH70ZS3E | M29W128GL70ZA3E |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | Parallel NOR Flash (SLC) | NOR Flash |
| Density | 128 Mbit (16 MB) | 128 Mbit |
| Organisasi | 8M x16 (x8/x16 capable family) | 16M x 8 / 8M x 16 |
| Access Time | 70 ns | 70 ns |
| Tegangan Pemberi Arus | 2.7 V to 3.6 V | 3V / 3.3V |
| Antaramuka | Parallel, Asynchronous | Parallel |
| Boot Block | Top Boot Block | — |
| Suhu Operasi | -40C to +125C | -40C to +125C |
| Kemasan | 64-FBGA (11 x 13 mm), LBGA | 64-TBGA (10x13 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Technology | NOR Flash, SLC | — |
| Common Flash Interface | Yes | — |
| Block Protection | Hardware/Software block protection | — |
| Automotive Temperature Grade | Yes (-40C to +125C) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Boot Block Location | — | Bottom boot (GL variant) |
| Bus Width Selection | — | BYTE pin (x8/x16) |
| Packaging | — | Tray |
| Product Longevity Program | — | No |
| FBGA Code | — | [DATA_NEEDED: FBGA Code] |
| Program/Erase Endurance | — | [DATA_NEEDED: Program/Erase Endurance] |