MC9RS08LA8CLF vs MC9RS08KA8CWJ Perbandingan
Perbandingan bersamaan detil MC9RS08LA8CLF dari NXP Semiconductors dan MC9RS08KA8CWJ dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9RS08LA8CLF - 8KB Flash 8-Bit RS08 MCU w/ LCD | NXP
MC9RS08LA8CLF ⚠ Waktu Beli TerakhirNXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MC9RS08LA8CLF | MC9RS08KA8CWJ |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Core | RS08 (8-bit HC08 subset) | — |
| Program Memory Size | 8 KB (8K x 8) Flash | 8 KB Flash |
| RAM Size | 256 B | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O Lines | 31 | — |
| Oscillator Type | Internal | — |
| LCD Driver | Integrated segmented LCD with charge pump | — |
| Paket / Case | 48-LQFP (7x7) | — |
| Tipe Mounting | Surface Mount | Surface Mount (SMD/SMT) |
| Rentang Suhu Kerja | -40C to +85C | -40 C to +85 C (Industrial) |
| Program Memory Type | Flash | — |
| Connectivity | I2C, SCI/SPI, GPIO | — |
| Peripherals | LCD driver, RTCC, ADC, TIM, KBI, BDM | Keyboard Interface (KBI), Timers, Internal Clock Source |
| Packaging | Tray | — |
| Level MSL | 3 | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status from data] |
| Series | RS08LA | — |
| Lifecycle | End of Life (Last Time Buy announced by NXP) | — |
| Core Architecture | — | RS08 (8-bit, HC08 subset) |
| Lebar Bus Data | — | 8 bit |
| Operating Voltage Range | — | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) |
| Number of I/O Pins | — | 18 |
| Paket | — | 20-SOIC Wide (20-SOIC W, Tube) |
| Pin/Package Count | — | 20 pins |
| Instruction Set | — | Subset of HC08 with added BGND instruction |
| Packaging Method | — | Tube |