MC9RS08LA8CLF vs MC9RS08KA8CWJ Karşılaştırma
Ayrıntılı yan yana karşılaştırma MC9RS08LA8CLF tarafından NXP Semiconductors ve MC9RS08KA8CWJ tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MC9RS08LA8CLF - 8KB Flash 8-Bit RS08 MCU w/ LCD | NXP
MC9RS08LA8CLF ⚠ Son Satın AlmaNXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | MC9RS08LA8CLF | MC9RS08KA8CWJ |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Son Alış Zamanı | Son Alış Zamanı |
| Core | RS08 (8-bit HC08 subset) | — |
| Program Memory Size | 8 KB (8K x 8) Flash | 8 KB Flash |
| RAM Size | 256 B | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O Lines | 31 | — |
| Oscillator Type | Internal | — |
| LCD Driver | Integrated segmented LCD with charge pump | — |
| Paket / Kas | 48-LQFP (7x7) | — |
| Montaj Türü | Surface Mount | Surface Mount (SMD/SMT) |
| İşletim Sıcaklığı Aralığı | -40C to +85C | -40 C to +85 C (Industrial) |
| Program Memory Type | Flash | — |
| Connectivity | I2C, SCI/SPI, GPIO | — |
| Peripherals | LCD driver, RTCC, ADC, TIM, KBI, BDM | Keyboard Interface (KBI), Timers, Internal Clock Source |
| Packaging | Tray | — |
| MSL Seviyesi | 3 | [DATA_NEEDED: MSL level] |
| RoHS Durumu | Compliant | [DATA_NEEDED: RoHS status from data] |
| Series | RS08LA | — |
| Lifecycle | End of Life (Last Time Buy announced by NXP) | — |
| Core Architecture | — | RS08 (8-bit, HC08 subset) |
| Veri Bus Genişliği | — | 8 bit |
| Operating Voltage Range | — | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) |
| Number of I/O Pins | — | 18 |
| Paket | — | 20-SOIC Wide (20-SOIC W, Tube) |
| Pin/Package Count | — | 20 pins |
| Instruction Set | — | Subset of HC08 with added BGND instruction |
| Packaging Method | — | Tube |