MC9S08AC16CFDE vs MC9S08AC32CFDE Perbandingan
Perbandingan bersamaan detil MC9S08AC16CFDE dari NXP Semiconductors dan MC9S08AC32CFDE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP
MC9S08AC16CFDE ✗ Akhir HidupNXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S08AC16CFDE | MC9S08AC32CFDE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | NRND |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Frekuensi Bawah Maximum | 40 MHz | — |
| Flash Memory | 16 KB (16K x 8) | — |
| RAM Size | 4 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 38 | — |
| Program Memory Type | Flash | — |
| Package Type | 48-QFN-EP (7x7 mm), HVQCCN | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Peripherals | [DATA_NEEDED: peripheral list (timers, SCI/SPI)] | — |
| Series | S08AC (Flexis series) | — |
| Life Cycle Stage | End of Life (per NXP product page) | — |
| Status RoHS | RoHS Compliant | — |
| Package Pin Count | 48 | — |
| Packaging | Tray | — |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Rentang Suhu Kerja | — | -40 C to +125 C (automotive grade) |
| Number of I/O Pins | — | 38 |
| Paket | — | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| ADC | — | 8-channel, 10-bit |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Communication Interfaces | — | SCI (UART) and SPI |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Lebar Bus Data | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |
| Status Lingkungan Hidup | — | NRND (Not Recommended for New Designs, per NXP product page) |