MC9S08AC16CFDE vs MC9S08AC32CFDE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08AC16CFDE sa pamamagitan ng NXP Semiconductors at MC9S08AC32CFDE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP
MC9S08AC16CFDE ✗ Tapus ng BuhayNXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndPagsanggunian na paghahambing
| Parametro | MC9S08AC16CFDE | MC9S08AC32CFDE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | NRND |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maksimum na Taktiko ng Oras | 40 MHz | — |
| Flash Memory | 16 KB (16K x 8) | — |
| RAM Size | 4 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 38 | — |
| Program Memory Type | Flash | — |
| Package Type | 48-QFN-EP (7x7 mm), HVQCCN | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Peripherals | [DATA_NEEDED: peripheral list (timers, SCI/SPI)] | — |
| Series | S08AC (Flexis series) | — |
| Life Cycle Stage | End of Life (per NXP product page) | — |
| Tindminan RoHS | RoHS Compliant | — |
| Package Pin Count | 48 | — |
| Packaging | Tray | — |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Hanay ng Temperature na Operasyon | — | -40 C to +125 C (automotive grade) |
| Number of I/O Pins | — | 38 |
| Packhaging | — | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| ADC | — | 8-channel, 10-bit |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Communication Interfaces | — | SCI (UART) and SPI |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Width ng Data Bus | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |
| Katayuan ng Lifecycle | — | NRND (Not Recommended for New Designs, per NXP product page) |