MC9S08AC60CFDE vs MC9S08AC32CFDE Perbandingan
Perbandingan bersamaan detil MC9S08AC60CFDE dari NXP Semiconductors dan MC9S08AC32CFDE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S08AC60CFDE | MC9S08AC32CFDE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-bit | — |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Tegangan Pemuat Kerja | 3.3 V / 5 V | — |
| Number of I/O | 38 | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | Up to 16-channel with automatic compare function | — |
| Communication Interfaces | 2x SCI (LIN 2.0, SAE J2602), SPI, IIC | SCI (UART) and SPI |
| Peripherals | ADC, SCI, SPI, IIC | — |
| Paket | 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| Tipe Mounting | Surface Mount | Surface Mount |
| Family Compatibility | Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) | — |
| Status Lingkungan Hidup | NRND (per NXP product page) | NRND (Not Recommended for New Designs, per NXP product page) |
| Status RoHS | ROHS COMPLIANT (per distributor datasheet listing) | — |
| Packaging | Tray | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | -40 C to +125 C (automotive grade) |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| RAM | — | 1 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Number of I/O Pins | — | 38 |
| ADC | — | 8-channel, 10-bit |
| Timers | — | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Lebar Bus Data | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |