MC9S08AC60CFDE vs MC9S08AC32CFDE Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08AC60CFDE disebabkan oleh NXP Semiconductors dan MC9S08AC32CFDE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S08AC60CFDE MC9S08AC60CFDE - 8-bit S08 MCU 60KB Flash 40MHz QFN-48 | NXP

MC9S08AC60CFDE - 8-bit S08 MCU 60KB Flash 40MHz QFN-48 | NXP

MC9S08AC60CFDE Nrnd

Pengandingan Spesifikasi

Parametr MC9S08AC60CFDE MC9S08AC32CFDE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core Processor S08 (HCS08), 8-bit CISC —
Core Size 8-bit —
CPU Clock Speed 40 MHz —
Internal Bus Frequency 20 MHz —
Flash Memory 60 KB (60K x 8) —
Supply Voltage Range 2.7 V to 5.5 V —
Tegangan Pemberi Arus Operasi 3.3 V / 5 V —
Number of I/O 38 —
ADC Resolution 10-bit —
ADC Channels Up to 16-channel with automatic compare function —
Communication Interfaces 2x SCI (LIN 2.0, SAE J2602), SPI, IIC SCI (UART) and SPI
Peripherals ADC, SCI, SPI, IIC —
Kemasan 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad 48-QFN-EP (7x7 mm) with exposed thermal pad
Jenis Pemasangan Surface Mount Surface Mount
Family Compatibility Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) —
Status Lingkungan Hidup NRND (per NXP product page) NRND (Not Recommended for New Designs, per NXP product page)
Status RoHS ROHS COMPLIANT (per distributor datasheet listing) —
Packaging Tray —
Gambaran Suhu Operasi [DATA_NEEDED: operating temperature range] -40 C to +125 C (automotive grade)
RAM Size [DATA_NEEDED: RAM size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Core Architecture — S08 (HCS08 family, 8-bit CISC)
Program Memory (Flash) — 32 KB
RAM — 1 KB
Maximum CPU Frequency — 40 MHz
Supply Voltage (VDD) — 2.7 V to 5.5 V
Number of I/O Pins — 38
ADC — 8-channel, 10-bit
Timers — 16-bit timer/PWM, plus additional 8-bit and 2-channel modules
Debug Interface — Single-wire BDM (Background Debug Mode)
Internal Clock Source — Yes (ICS - Internal Clock Source)
Temperature Grade — Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter]
Lebar Bus Data — 8-bit
MSL (Moisture Sensitivity Level) — MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life]
RoHS Compliance — Compliant (per NXP product page)
Lead-Free — Yes (per distributor packaging datasheet)

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