MC9S08MM32CLH vs MC9S08DN60ACLH Perbandingan
Perbandingan bersamaan detil MC9S08MM32CLH dari NXP Semiconductors dan MC9S08DN60ACLH dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S08MM32CLH - 8-Bit 48MHz S08 MCU 32KB Flash LQFP-64 | NXP
MC9S08MM32CLH ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MC9S08MM32CLH | MC9S08DN60ACLH |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08MM | — |
| Core Processor | HCS08 (S08 CISC) | — |
| Core Size | 8-Bit | — |
| Core Speed | 48 MHz | — |
| Program Memory | 32 KB Flash (32K x 8) | — |
| RAM Size | 2 KB | 2 KB (2K x 8) |
| Data EEPROM | Not specified in datasheet excerpt | — |
| Tegangan Pemuat | 1.8 V to 3.6 V (2.5 V/3.3 V typical) | — |
| Suhu Kerja | -40C to +85C | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Paket | 64-LQFP (10x10 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Connectivity | SCI, SPI, I2C | — |
| Peripherals | PWM, 12-bit ADC, Analog Comparator, Timers | — |
| Number of I/O | 56 (approximate, GPIO capable) | 53 |
| Oscillator Type | Internal + External Crystal | External |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| RoHS | Compliant | — |
| Core | — | HCS08 (S08 core) |
| Lebar Bus Data | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Paket / Case | — | 64-LQFP (10x10 mm) |
| ADC | — | 16-channel, 12-bit, 2.5 us conversion |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Interrupt Sources | — | Up to 32 |
| Packaging | — | Tray |
| Status RoHS | — | Compliant |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |