MC9S12E256CFUE vs MC9S12B64CFUE Perbandingan
Perbandingan bersamaan detil MC9S12E256CFUE dari NXP Semiconductors dan MC9S12B64CFUE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12E256CFUE - HCS12 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12E256CFUE ✓ AktifNXP Semiconductors
MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP
MC9S12B64CFUE ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MC9S12E256CFUE | MC9S12B64CFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | HCS12 / MC9S12E | — |
| Core Processor | HCS12 (16-bit) | — |
| Core Size | 16-bit | — |
| Maximum Bus Frequency | 25 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| RAM Size | 16 KB | — |
| EEPROM Size | 4 KB | — |
| Number of I/O Pins | 60 (approx., package-dependent) | — |
| Data Converters | A/D 8x10-bit | — |
| Connectivity | 3x SCI (UART), 1x SPI, 1x IIC | — |
| Timers/PWM | 3x TIM (4-channel 16-bit), 1x 6-channel 8-bit PWM | — |
| Tegangan Pemuat Kerja | 2.5 V core (5 V I/O tolerant) | — |
| Paket | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40C to +85C (industrial) | — |
| Status RoHS | Compliant | Compliant |
| Core | — | HCS12 (S12 CISC, 16-bit) |
| Flash Memory | — | 64 KB |
| RAM | — | 2 KB |
| EEPROM | — | 1 KB |
| Maximum CPU Frequency | — | 25 MHz |
| Tegangan Pemuat | — | 5 V (typical) |
| Rentang Suhu Kerja | — | 0C to +70C (commercial 'C' grade) |
| ADC | — | 8-channel, 10-bit |
| CAN Module | — | 1x MSCAN 2.0A/B |
| SCI/SPI | — | 2x SCI, 1x SPI |
| Timers | — | 16-bit Timer + 8-bit PWM + PIT |
| I/O Pins | — | [DATA_NEEDED: I/O pin count] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Lead-Free / Terminal Finish | — | Matte Tin (Sn) |
| Peak Reflow Temperature | — | 260C (max 40 s) |