MC9S12E256CFUE vs MC9S12B64CFUE Karşılaştırma
Ayrıntılı yan yana karşılaştırma MC9S12E256CFUE tarafından NXP Semiconductors ve MC9S12B64CFUE tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MC9S12E256CFUE - HCS12 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12E256CFUE ✓ AktifNXP Semiconductors
MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP
MC9S12B64CFUE ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | MC9S12E256CFUE | MC9S12B64CFUE |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Aktif | Son Alış Zamanı |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | HCS12 / MC9S12E | — |
| Core Processor | HCS12 (16-bit) | — |
| Core Size | 16-bit | — |
| Maximum Bus Frequency | 25 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| RAM Size | 16 KB | — |
| EEPROM Size | 4 KB | — |
| Number of I/O Pins | 60 (approx., package-dependent) | — |
| Data Converters | A/D 8x10-bit | — |
| Connectivity | 3x SCI (UART), 1x SPI, 1x IIC | — |
| Timers/PWM | 3x TIM (4-channel 16-bit), 1x 6-channel 8-bit PWM | — |
| İşletim Besleme Gerilimi | 2.5 V core (5 V I/O tolerant) | — |
| Paket | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) |
| Montaj Türü | Surface Mount | Surface Mount |
| İşletim Sıcaklığı | -40C to +85C (industrial) | — |
| RoHS Durumu | Compliant | Compliant |
| Core | — | HCS12 (S12 CISC, 16-bit) |
| Flash Memory | — | 64 KB |
| RAM | — | 2 KB |
| EEPROM | — | 1 KB |
| Maximum CPU Frequency | — | 25 MHz |
| Besleme Gerilimi | — | 5 V (typical) |
| İşletim Sıcaklığı Aralığı | — | 0C to +70C (commercial 'C' grade) |
| ADC | — | 8-channel, 10-bit |
| CAN Module | — | 1x MSCAN 2.0A/B |
| SCI/SPI | — | 2x SCI, 1x SPI |
| Timers | — | 16-bit Timer + 8-bit PWM + PIT |
| I/O Pins | — | [DATA_NEEDED: I/O pin count] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Lead-Free / Terminal Finish | — | Matte Tin (Sn) |
| Peak Reflow Temperature | — | 260C (max 40 s) |