MC9S12GC16MFAE vs MC9S12C32MFAE16 Perbandingan
Perbandingan bersamaan detil MC9S12GC16MFAE dari NXP Semiconductors dan MC9S12C32MFAE16 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12GC16MFAE - 16KB Flash 16-Bit HCS12 MCU | NXP | 48-LQFP
MC9S12GC16MFAE ObsoletePerbandingan Spesifikasi
| Parameter Umum | MC9S12GC16MFAE | MC9S12C32MFAE16 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Series | HCS12 / S12GC | — |
| Core Processor | HCS12 (16-bit CISC) | — |
| Core Size | 16-bit | — |
| CPU Speed | 25 MHz | — |
| Program Memory Size | 16 KB (16K x 8) | — |
| Program Memory Type | Flash | — |
| RAM Size | 1 KB (1K x 8) | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Number of I/O Pins | 31 | — |
| Tegangan Pemuat | 2.5 V / 5 V | — |
| ADC | 8-channel, 10-bit | 8-channel, 10-bit |
| Connectivity | EBI/EMI, SCI, SPI | — |
| Peripherals | POR, PWM, WDT | — |
| Paket | 48-LQFP (7x7 mm, 0.5 mm pitch) | 48-pin LQFP (7x7 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Operating Temperature Grade | Automotive (per Partstack) | — |
| Terminal Form / Pitch | GULL WING / 0.5 mm | — |
| Part Status | Obsolete (per abc-semi listing) | — |
| Core Architecture | — | HCS12 (16-bit CISC) |
| Family | — | S12C |
| Program Memory | — | 32 KB Flash |
| RAM | — | 2 KB |
| EEPROM | — | 1 KB |
| Bus Clock / CPU Frequency | — | 16 MHz |
| Supply Voltage (VDD) | — | 2.97 V to 5.5 V (5 V nominal, 2.5 V mode supported) |
| GPIO Count | — | Up to 38 |
| Communication Interfaces | — | SCI (UART), SPI, I2C |
| Timers | — | Enhanced Capture Timer (ECT) + PWM channels |
| On-chip Voltage Regulator | — | Yes (bandgap-based VREG) |
| On-chip PLL | — | Yes |
| Debug Interface | — | Background Debug Mode (BDM) |
| Suhu Kerja | — | -40 C to +85 C (automotive grade) |
| Status RoHS | — | [DATA_NEEDED: rohs status per part marking] |