MCF5275LCVM166 vs MCF5275CVM166 Perbandingan
Perbandingan bersamaan detil MCF5275LCVM166 dari NXP Semiconductors dan MCF5275CVM166 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MCF5275CVM166 - ColdFire V2 32-bit MPU, 166MHz, 256-MAPBGA | NXP
MCF5275CVM166 NrndPerbandingan Spesifikasi
| Parameter Umum | MCF5275LCVM166 | MCF5275CVM166 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core Architecture | ColdFire V2 (32-bit, variable-length RISC) | — |
| Maximum Core Clock | 166 MHz | — |
| On-chip SRAM | 64 KB | — |
| Program Memory | ROMless (external memory required) | — |
| Tegangan Pemuat | 3.3 V I/O, internal core rail generated on-chip | — |
| Ethernet | 10/100 MAC with MII/RMII | Dual 10/100 MAC |
| USB | USB 2.0 full-speed device/host | USB 1.1 device/host |
| UART | 2 | — |
| I2C | 2 | — |
| DMA Channels | 16 (eDMA) | — |
| Timers | 4 x 32-bit | — |
| External Bus | 16-bit EBI (SDRAM/SRAM/ROM) | — |
| Paket | 196-LBGA (15x15 mm) | 256-MAPBGA (17x17 mm) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| Status RoHS | Compliant | Compliant |
| Core | — | ColdFire V2 (32-bit) |
| Frekuensi Bawah Maximum | — | 166 MHz |
| On-Chip SRAM | — | 64 KB |
| Program Memory Size | — | ROMless |
| Program Memory Type | — | External (ROMless) |
| Number of I/O Lines | — | 69 |
| Connectivity | — | EBI/EMI, Ethernet, I2C, SPI (QSPI), UART/USART, USB |
| CAN | — | 2x CAN 2.0B |
| Peripherals | — | DMA, WDT, timers, hardware crypto (DES/3DES/AES/SHA) |
| Supply Voltage Core | — | 1.5 V |
| Supply Voltage I/O | — | 3.3 V |