MCF5275LCVM166 vs MCF5275CVM166 比較
詳細並排比較 MCF5275LCVM166 由 NXP Semiconductors 與 MCF5275CVM166 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MCF5275CVM166 - ColdFire V2 32-bit MPU, 166MHz, 256-MAPBGA | NXP
MCF5275CVM166 Nrnd規格比較
| 參數 | MCF5275LCVM166 | MCF5275CVM166 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Core Architecture | ColdFire V2 (32-bit, variable-length RISC) | — |
| Maximum Core Clock | 166 MHz | — |
| On-chip SRAM | 64 KB | — |
| Program Memory | ROMless (external memory required) | — |
| 供應電壓 | 3.3 V I/O, internal core rail generated on-chip | — |
| Ethernet | 10/100 MAC with MII/RMII | Dual 10/100 MAC |
| USB | USB 2.0 full-speed device/host | USB 1.1 device/host |
| UART | 2 | — |
| I2C | 2 | — |
| DMA Channels | 16 (eDMA) | — |
| Timers | 4 x 32-bit | — |
| External Bus | 16-bit EBI (SDRAM/SRAM/ROM) | — |
| 封裝 | 196-LBGA (15x15 mm) | 256-MAPBGA (17x17 mm) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| RoHS 狀態 | Compliant | Compliant |
| Core | — | ColdFire V2 (32-bit) |
| 最大時脈頻率 | — | 166 MHz |
| On-Chip SRAM | — | 64 KB |
| Program Memory Size | — | ROMless |
| Program Memory Type | — | External (ROMless) |
| Number of I/O Lines | — | 69 |
| Connectivity | — | EBI/EMI, Ethernet, I2C, SPI (QSPI), UART/USART, USB |
| CAN | — | 2x CAN 2.0B |
| Peripherals | — | DMA, WDT, timers, hardware crypto (DES/3DES/AES/SHA) |
| Supply Voltage Core | — | 1.5 V |
| Supply Voltage I/O | — | 3.3 V |