MCF53015CMJ240J vs MCF53017CMJ240 Perbandingan
Perbandingan bersamaan detil MCF53015CMJ240J dari NXP Semiconductors dan MCF53017CMJ240 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MCF53015CMJ240J - ColdFire V3 MPU 240MHz | 256-MAPBGA | NXP
MCF53015CMJ240J ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MCF53015CMJ240J | MCF53017CMJ240 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Core Processor | ColdFire V3 | — |
| Core Size | 32-Bit | — |
| Maximum Clock Speed | 240 MHz | — |
| Program Memory Type | ROMless (external memory required) | — |
| Paket | 256-MAPBGA (17x17 mm) | — |
| Number of I/O | 83 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, Memory Card, SSI, SPI, UART/USART, USB, USB OTG | — |
| Peripherals | DMA, PWM, WDT | — |
| Core Feature | EMAC (Enhanced Multiply-Accumulate) | — |
| On-chip Voice Codec | Yes (integrated) | — |
| Supply Voltage Range | [DATA_NEEDED: Vcore/VIo voltage range] | — |
| Rentang Suhu Kerja | Industrial grade (per Freescale datasheet Partstack record) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface mount |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant (per NXP product family policy) | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Bebas Halogen | [DATA_NEEDED: halogen status] | — |
| Ethernet MAC | Integrated 10/100 Ethernet MAC | EMAC |
| Status Lingkungan Hidup | Last Time Buy | — |
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) | NXP Semiconductors |
| Product Type | — | 32-bit embedded microprocessor |
| Processor Architecture | — | ColdFire Version 3 |
| Operating Frequency | — | 240 MHz |
| Tegangan Pemuat | — | 3.3 V |
| Memory Configuration | — | ROMless |
| Temperature Grade | — | Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 256 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Package Description | — | MAP-BGA brick |
| Core | — | Version 3 ColdFire core |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |