MCF53015CMJ240J vs MCF53017CMJ240 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MCF53015CMJ240J disebabkan oleh NXP Semiconductors dan MCF53017CMJ240 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MCF53015CMJ240J - ColdFire V3 MPU 240MHz | 256-MAPBGA | NXP
MCF53015CMJ240J ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MCF53015CMJ240J | MCF53017CMJ240 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Core Processor | ColdFire V3 | — |
| Core Size | 32-Bit | — |
| Maximum Clock Speed | 240 MHz | — |
| Program Memory Type | ROMless (external memory required) | — |
| Kemasan | 256-MAPBGA (17x17 mm) | — |
| Number of I/O | 83 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, Memory Card, SSI, SPI, UART/USART, USB, USB OTG | — |
| Peripherals | DMA, PWM, WDT | — |
| Core Feature | EMAC (Enhanced Multiply-Accumulate) | — |
| On-chip Voice Codec | Yes (integrated) | — |
| Supply Voltage Range | [DATA_NEEDED: Vcore/VIo voltage range] | — |
| Gambaran Suhu Operasi | Industrial grade (per Freescale datasheet Partstack record) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface mount |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant (per NXP product family policy) | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Boson Bebas | [DATA_NEEDED: halogen status] | — |
| Ethernet MAC | Integrated 10/100 Ethernet MAC | EMAC |
| Status Lingkungan Hidup | Last Time Buy | — |
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) | NXP Semiconductors |
| Product Type | — | 32-bit embedded microprocessor |
| Processor Architecture | — | ColdFire Version 3 |
| Operating Frequency | — | 240 MHz |
| Tegangan Pemberi Arus | — | 3.3 V |
| Memory Configuration | — | ROMless |
| Temperature Grade | — | Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 256 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Package Description | — | MAP-BGA brick |
| Core | — | Version 3 ColdFire core |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |