MPC566AZP56 vs MPCZ565MVR56 Perbandingan
Perbandingan bersamaan detil MPC566AZP56 dari NXP Semiconductors dan MPCZ565MVR56 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 ObsoletePerbandingan Spesifikasi
| Parameter Umum | MPC566AZP56 | MPCZ565MVR56 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Qorivva (MPC5xx) | — |
| Core | PowerPC Power Architecture with FPU + BCC | — |
| Lebar Bus Data | 32-bit | 32-bit |
| Program Memory Size | 1 MB (1M x 8) FLASH | 1 MB Flash |
| RAM Size | 36 KB | 64 KB [DATA_NEEDED: exact value] |
| Frekuensi Bawah Maximum | 56 MHz | 40 MHz |
| Rentang Suhu Kerja | -55 C to +125 C (Automotive Grade) | -40C to +125C |
| Package Type | 388-PBGA (27x27 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Automotive Grade | Yes | Yes |
| Code Compression | Yes (Code compression, optimized for non-cached automotive code) | — |
| FPU | Dual precision floating-point unit | — |
| Lead Free / RoHS Status | [DATA_NEEDED: lead free status] | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Supply Voltage Range | [DATA_NEEDED: Vcc range] | [DATA_NEEDED: Vdd/Vdd range] |
| Peripherals | [DATA_NEEDED: peripheral set (CAN, SPI, SCI, etc.)] | — |
| Number of I/Os | [DATA_NEEDED: GPIO count] | — |
| Core Architecture | — | Power Architecture (MPC500 family) |
| Paket / Case | — | 388-ball PBGA |
| Number of I/O Pins | — | [DATA_NEEDED: exact I/O count] |
| Floating Point Unit | — | Yes (IEEE 754) |
| CAN Controllers | — | 2 (CAN 2.0B) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| Tingkat Sensitivitas Kekeringan (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Process Technology | — | 0.25 micron CMOS |