MPC566AZP56 vs MPCZ565MVR56 Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC566AZP56 tarafından NXP Semiconductors ve MPCZ565MVR56 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 ObsoleteÖzellik Karşılaştırması
| Parametre | MPC566AZP56 | MPCZ565MVR56 |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | NRND | Obsolete |
| Family | Qorivva (MPC5xx) | — |
| Core | PowerPC Power Architecture with FPU + BCC | — |
| Veri Bus Genişliği | 32-bit | 32-bit |
| Program Memory Size | 1 MB (1M x 8) FLASH | 1 MB Flash |
| RAM Size | 36 KB | 64 KB [DATA_NEEDED: exact value] |
| Azami Saat Hızı | 56 MHz | 40 MHz |
| İşletim Sıcaklığı Aralığı | -55 C to +125 C (Automotive Grade) | -40C to +125C |
| Package Type | 388-PBGA (27x27 mm) | — |
| Montaj Türü | Surface Mount | Surface Mount |
| Automotive Grade | Yes | Yes |
| Code Compression | Yes (Code compression, optimized for non-cached automotive code) | — |
| FPU | Dual precision floating-point unit | — |
| Lead Free / RoHS Status | [DATA_NEEDED: lead free status] | — |
| MSL Seviyesi | [DATA_NEEDED: MSL level] | — |
| Supply Voltage Range | [DATA_NEEDED: Vcc range] | [DATA_NEEDED: Vdd/Vdd range] |
| Peripherals | [DATA_NEEDED: peripheral set (CAN, SPI, SCI, etc.)] | — |
| Number of I/Os | [DATA_NEEDED: GPIO count] | — |
| Core Architecture | — | Power Architecture (MPC500 family) |
| Paket / Kas | — | 388-ball PBGA |
| Number of I/O Pins | — | [DATA_NEEDED: exact I/O count] |
| Floating Point Unit | — | Yes (IEEE 754) |
| CAN Controllers | — | 2 (CAN 2.0B) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| Nem Hassasiyet Seviyesi (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Process Technology | — | 0.25 micron CMOS |