MPC8308CVMADD vs MPC8306CVMADDCA Perbandingan
Perbandingan bersamaan detil MPC8308CVMADD dari NXP Semiconductors dan MPC8306CVMADDCA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8308CVMADD - PowerQUICC II Pro SoC 266MHz | NXP Semiconductors
MPC8308CVMADD ✓ AktifNXP Semiconductors
MPC8306CVMADDCA - PowerQUICC II Pro 266MHz SoC | NXP Semiconductors
MPC8306CVMADDCA ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MPC8308CVMADD | MPC8306CVMADDCA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors |
| Series | PowerQUICC II Pro | MPC830x PowerQUICC II Pro |
| Core | e300c3 (Power Architecture Book-E) | — |
| Core Count | 1 | 1 |
| Core Frequency | 266 MHz | — |
| Lebar Bus Data | 32-bit | 32-bit |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| Memory Controller | DDR2 up to 266 MHz data rate | DDR1/DDR2 with ECC, up to 256 MB |
| PCI Express | 1 x PCIe interface | — |
| Ethernet MACs | 2 x 10/100/1000 (MII, RGMII) | — |
| USB | USB 2.0 | 2x USB 2.0 Full-Speed (Host/Device/OTG) |
| Local Bus | Yes (with NAND flash support) | — |
| Paket | 473-MAPBGA (19x19 mm) | 369-PBGA (19x19 mm) |
| Suhu Kerja | -40C to +105C (extended) | -40C to +105C (extended) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: confirm from lot] | — |
| Core Architecture | — | Power Architecture (e300c3) |
| Frekuensi Bawah Maximum | — | 266 MHz |
| Core Supply Voltage | — | 0.95 V to 1.05 V |
| I/O Supply Voltage | — | 3.3 V |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| Ethernet | — | 2x 10/100 (R/MII) with QoS, IEEE 1588 v2 |
| CAN | — | 2x CAN 2.0B |
| UART | — | 4x |
| Other Peripherals | — | I2C x2, SPI, Local Bus, HDLC/TDM |
| Security Engine | — | SEC 2.0 (DES/3DES/AES/SHA, RNG) |
| Packaging | — | Tray |
| Lead Free / RoHS | — | Lead Free / RoHS Compliant |
| Lifecycle | — | Last Time Buy (EOL announced) |