MPC860DPZQ66D4 vs MPC860TZQ66D4 Perbandingan
Perbandingan bersamaan detil MPC860DPZQ66D4 dari NXP Semiconductors dan MPC860TZQ66D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP
MPC860DPZQ66D4 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MPC860DPZQ66D4 | MPC860TZQ66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Akhir Hidup |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | — |
| Core | 1 Core, 32-Bit PowerPC | — |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| Paket / Case | 357-Ball PBGA, 25 x 25 mm | 357-PBGA (25x25 mm) |
| Packaging | Tray | Tray |
| Lead-Free Status | Contains Lead | — |
| Status RoHS | Non-RoHS (legacy BGA, contains lead) | RoHS non-compliant (Contains Lead) |
| Suhu Kerja | 0C to +70C (commercial grade) | 0 °C to +70 °C |
| Part Status | Not For New Designs | — |
| Manufacturer | — | NXP Semiconductors |
| Part Family | — | MPC8xx PowerQUICC |
| Core Architecture | — | PowerPC, 32-bit |
| Core Count | — | 1 |
| Core Frequency | — | 66 MHz |
| Tegangan Pemuat | — | 3.3 V |
| Lead Free Status | — | Contains Lead |
| Communications Module | — | CPM (QUICC Engine) |
| Tipe Mounting | — | Surface Mount |
| Status Lingkungan Hidup | — | End of Life (per NXP) |
| Kategori | — | Microprocessors - MPU |