MPC860TVR50D4 vs MPC860TZQ50D4-FR Perbandingan
Perbandingan bersamaan detil MPC860TVR50D4 dari NXP Semiconductors dan MPC860TZQ50D4-FR dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860TVR50D4 | MPC860TZQ50D4-FR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit |
| Core Count | 1 | 1 |
| Frekuensi Bawah Maximum | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Paket / Case | 357-PBGA (25x25 mm) | — |
| Process Technology | 0.32 µm CMOS | — |
| Instruction Cache | 4 Kbyte | 4 Kbytes |
| Data Cache | 4 Kbyte | 4 Kbytes |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | — |
| Rentang Suhu Kerja | -40°C to +95°C | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Series | MPC8xx PowerQUICC | MPC860 PowerQUICC |
| Status RoHS | [DATA_NEEDED: rohs compliance] | Non-Compliant |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Operating Frequency | — | 50 MHz |
| Paket | — | 357-PBGA (25 mm x 25 mm) |
| Supply Voltage (I/O) | — | 3.3 V |
| External Data Bus | — | 32-bit |
| Integrated Module | — | CPM (Communications Processor Module) |
| Serial Controllers | — | SCC, SMC, SPI, I2C, HDLC, UART, Ethernet |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Lead Free Status | — | Contains Lead |
| Packaging | — | Tray |
| Status Lingkungan Hidup | — | Obsolete (End of Life per NXP product page) |